All done! There's definitely a lot more punch to the sound now! ;)
The hardest part was getting the PCBs out and back in, not a lot of room maneuver inside the case. Some cleanup of the thermal paste was required as well but other than that, everything went smoothly for my first recap job.
The hardest part was getting the PCBs out and back in, not a lot of room maneuver inside the case. Some cleanup of the thermal paste was required as well but other than that, everything went smoothly for my first recap job.