Bob the reasoning is so as to not introduce thermal stress points due to larger temperature differentials across a small heat-sinked area. Cold air blowing directly onto component causes a much larger thermal stress differential over a smaller area, with corresponding variations in semiconductor operating temperature, vs. drawing the colder air across a larger thermal area via drawing heat away from the heat sinked area.
Similar issues are noted when using glassware; thermal stresses occur across an even smaller glass area of a tube envelope vs. drawing the heat away.